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集積回路のための高度なパッケージング世界市場の発展状況と動向 2024-2030

英文タイトル: Global IC Advanced Packaging Market Insights, Forecast to 2030

集積回路のための高度なパッケージング世界市場の発展状況と動向 2024-2030
  • レポートID:279463
  • 発表時期:2024-04-25
  • 訪問回数:716
  • ページ数:107
  • レポート形式:PDF
  • レポート言語:英語、日本語
  • グラフ数:133
  • レポートカテゴリ: ソフト及び商業サービス

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概要

本報告書は集積回路のための高度なパッケージング市場規模の世界市場の概要を紹介します。2019~2023年の歴史的な市場収益データ、2024年の予想、および2030年までのCAGRの予測を含む世界市場動向の分析。レポートは集積回路のための高度なパッケージングの主要メーカーを詳細に分析し、地域別・国別の収益プロフィールを明らかにしています。 本レポートでは特に、主要地域/国別のセグメントとサブセグメントについて、将来の市場ポテンシャルの探索と予測に焦点を当てています。 複数の地域にわたる包括的なデータと市場価値分析により、読者は包括的かつ詳細な市場洞察を得ることができます。

世界の集積回路のための高度なパッケージング市場の主な参加者である企業概要、収益、粗利益率、ポートフォリオ、地理的位置、重要な発展について、次のパラメータに基づいて説明します。レポートは集積回路のための高度なパッケージングのメーカー、地域、種類と端末業界の角度から世界と主要地域の市場現状と将来性を研究した、このレポートでは、世界と主要地域のトップメーカーを分析し、タイプとアプリケーション/端末業界別に集積回路のための高度なパッケージング市場を分類しています。本研究に含まれる主な企業は:Abel、Samsung、Toshiba、Intel、Amkor、MAK、Optocap、ASE、Changing Electronics Technology、STMicroelectronics、EKSS Microelectronics

地域別市場区分、地域別分析は以下の通り:
    アメリカとカナダ
    中国
    アジア
    ヨーロッパ
    中東、アフリカ、ラテンアメリカ

タイプ別市場セグメント:
3D
2.5D

用途別の市場セグメント:
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power

レポートの詳細内容
世界の集積回路のための高度なパッケージング市場の現状と将来について、グローバルの主要地域を中心に包括的に分析しています。 当レポートでは、多角的な分析を通じて、市場プレイヤー、地域分布、集積回路のための高度なパッケージングタイプ、最終用途アプリケーションなどの主要分野を掘り下げ、読者に包括的な市場洞察を提供しています。 レポートは主要企業の集積回路のための高度なパッケージング収益、市場シェア、業界ランキング、2019年から2024年までのデータに焦点を当てています。世界の集積回路のための高度なパッケージング市場における主要なステークホルダーの特定、最近の動向とセグメント収益に基づいて競争状況と市場ポジショニングの分析。また、当レポートでは、世界市場の主要プレイヤーを特定し、プロファイルを作成するとともに、集積回路のための高度なパッケージング市場を綿密に分類・応用することで、読者が市場構造とダイナミクスをより正確に把握できるようにし、十分な情報に基づいた意思決定と戦略立案に強力なサポートを提供しています。

集積回路のための高度なパッケージングのレポートは2019年から2030年までのタイプ別およびアプリケーション別、収益、成長率別のセグメントデータを分析します。収益、予測成長傾向、アプリケーション、およびエンドユーザー業界の市場規模を評価および予測します。

章の概要
1章:集積回路のための高度なパッケージングのレポートの報告範囲、各セグメントの市場規模、将来の開発可能性などを含む、さまざまな市場セグメント(製品タイプ、用途など)のエグゼクティブサマリーを紹介します。市場の現状と、短期から中期、および長期的な進化の可能性をハイレベルに見ることができます。(20192030
2章:集積回路のための高度なパッケージングの世界及び地域レベルでの売上高。各地域とその主要国の市場規模と発展の可能性を定量的に分析し、世界各国の市場発展、今後の発展展望、市場空間、生産能力などを紹介する。また、市場ダイナミクス、市場の最新動向、市場の推進要因と制限要因、業界企業が直面する課題とリスク、業界の関連政策の分析などを紹介しています。(20192030
3集積回路のための高度なパッケージング企業の競争状況、収益、市場シェアと業界ランキング、最新の開発計画、合併・買収情報などの詳細分析。(20192030
4章:各市場セグメントの収益と開発の可能性をカバーし、種類別のさまざまな市場セグメントの分析を提供し、読者がさまざまな市場セグメントでブルーオーシャン市場を見つけるのに役立ちます。(20192024
5章:集積回路のための高度なパッケージングの各市場セグメントの収益と開発の可能性をカバーするアプリケーション別のさまざまな市場セグメントの分析を提供し、読者がさまざまな下流市場でブルーオーシャン市場を見つけるのに役立ちます。(20192030
6章:北米(米国、カナダ)のタイプ別、アプリケーション別、国別、各セグメントの収益。(20192030
7章:ヨーロッパのタイプ別、アプリケーション別、国別、各セグメントの収益。(20192030
8章:中国の種類別、および用途別、各セグメントの収益。(20192030
9章アジア(中国を除く)の種類別、用途別、地域別、セグメントごとの収益。(20192030
10章:中東、アフリカ、ラテンアメリカの種類別、アプリケーション別、国別、各セグメントの収益。(20192030
11章:集積回路のための高度なパッケージングの主要企業の概要を提供し、製品の説明と仕様、集積回路のための高度なパッケージングの収益、粗利益率、最近の展開など、市場の主要企業の基本状況を詳細に紹介します。(20192024
12章:アナリストの見解/結論

biaoTi

概要

Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.

Market Analysis and Insights: Global IC Advanced Packaging Market
The global IC Advanced Packaging market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Covers:
This report presents an overview of global market for IC Advanced Packaging market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030. 
This report researches the key producers of IC Advanced Packaging, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for IC Advanced Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the IC Advanced Packaging revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global IC Advanced Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for IC Advanced Packaging revenue, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Abel, Samsung, Toshiba, Intel, Amkor, MAK, Optocap, ASE and Changing Electronics Technology, etc.

Market Segmentation
By Company
    Abel
    Samsung
    Toshiba
    Intel
    Amkor
    MAK
    Optocap
    ASE
    Changing Electronics Technology
    STMicroelectronics
    EKSS Microelectronics

Segment by Type
    3D
    2.5D

Segment by Application
    Logic
    Imaging and Optoelectronics
    Memory
    MEMS/Sensors
    LED
    Power

By Region
    North America
        United States
        Canada
    Europe
        Germany
        France
        UK
        Italy
        Russia
        Nordic Countries
        Rest of Europe
    China
    Asia (excluding China)
        Japan
        South Korea
        China Taiwan
       Southeast Asia
        India
    Latin America, Middle East & Africa
        Brazil
        Mexico
        Turkey
        Israel
        GCC Countries

Chapter Outline
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of IC Advanced Packaging in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Advanced Packaging companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, IC Advanced Packaging revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
biaoTi

総目録

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Advanced Packaging Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 3D
1.2.3 2.5D
1.3 Market by Application
1.3.1 Global IC Advanced Packaging Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Logic
1.3.3 Imaging and Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered

2 Global Growth Trends
2.1 Global IC Advanced Packaging Market Perspective (2019-2030)
2.2 Global IC Advanced Packaging Growth Trends by Region
2.2.1 IC Advanced Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 IC Advanced Packaging Historic Market Size by Region (2019-2024)
2.2.3 IC Advanced Packaging Forecasted Market Size by Region (2025-2030)
2.3 IC Advanced Packaging Market Dynamics
2.3.1 IC Advanced Packaging Industry Trends
2.3.2 IC Advanced Packaging Market Drivers
2.3.3 IC Advanced Packaging Market Challenges
2.3.4 IC Advanced Packaging Market Restraints

3 Competition Landscape by Key Players
3.1 Global Revenue IC Advanced Packaging by Players
3.1.1 Global IC Advanced Packaging Revenue by Players (2019-2024)
3.1.2 Global IC Advanced Packaging Revenue Market Share by Players (2019-2024)
3.2 Global IC Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of IC Advanced Packaging, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global IC Advanced Packaging Market Concentration Ratio
3.4.1 Global IC Advanced Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Advanced Packaging Revenue in 2023
3.5 Global Key Players of IC Advanced Packaging Head office and Area Served
3.6 Global Key Players of IC Advanced Packaging, Product and Application
3.7 Global Key Players of IC Advanced Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans

4 IC Advanced Packaging Breakdown Data by Type
4.1 Global IC Advanced Packaging Historic Market Size by Type (2019-2024)
4.2 Global IC Advanced Packaging Forecasted Market Size by Type (2025-2030)

5 IC Advanced Packaging Breakdown Data by Application
5.1 Global IC Advanced Packaging Historic Market Size by Application (2019-2024)
5.2 Global IC Advanced Packaging Forecasted Market Size by Application (2025-2030)

6 North America
6.1 North America IC Advanced Packaging Market Size (2019-2030)
6.2 North America IC Advanced Packaging Market Size by Type
6.2.1 North America IC Advanced Packaging Market Size by Type (2019-2024)
6.2.2 North America IC Advanced Packaging Market Size by Type (2025-2030)
6.2.3 North America IC Advanced Packaging Market Share by Type (2019-2030)
6.3 North America IC Advanced Packaging Market Size by Application
6.3.1 North America IC Advanced Packaging Market Size by Application (2019-2024)
6.3.2 North America IC Advanced Packaging Market Size by Application (2025-2030)
6.3.3 North America IC Advanced Packaging Market Share by Application (2019-2030)
6.4 North America IC Advanced Packaging Market Size by Country
6.4.1 North America IC Advanced Packaging Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America IC Advanced Packaging Market Size by Country (2019-2024)
6.4.3 North America IC Advanced Packaging Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada

7 Europe
7.1 Europe IC Advanced Packaging Market Size (2019-2030)
7.2 Europe IC Advanced Packaging Market Size by Type
7.2.1 Europe IC Advanced Packaging Market Size by Type (2019-2024)
7.2.2 Europe IC Advanced Packaging Market Size by Type (2025-2030)
7.2.3 Europe IC Advanced Packaging Market Share by Type (2019-2030)
7.3 Europe IC Advanced Packaging Market Size by Application
7.3.1 Europe IC Advanced Packaging Market Size by Application (2019-2024)
7.3.2 Europe IC Advanced Packaging Market Size by Application (2025-2030)
7.3.3 Europe IC Advanced Packaging Market Share by Application (2019-2030)
7.4 Europe IC Advanced Packaging Market Size by Country
7.4.1 Europe IC Advanced Packaging Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe IC Advanced Packaging Market Size by Country (2019-2024)
7.4.3 Europe IC Advanced Packaging Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries

8 China
8.1 China IC Advanced Packaging Market Size (2019-2030)
8.2 China IC Advanced Packaging Market Size by Type
8.2.1 China IC Advanced Packaging Market Size by Type (2019-2024)
8.2.2 China IC Advanced Packaging Market Size by Type (2025-2030)
8.2.3 China IC Advanced Packaging Market Share by Type (2019-2030)
8.3 China IC Advanced Packaging Market Size by Application
8.3.1 China IC Advanced Packaging Market Size by Application (2019-2024)
8.3.2 China IC Advanced Packaging Market Size by Application (2025-2030)
8.3.3 China IC Advanced Packaging Market Share by Application (2019-2030)

9 Asia (excluding China)
9.1 Asia IC Advanced Packaging Market Size (2019-2030)
9.2 Asia IC Advanced Packaging Market Size by Type
9.2.1 Asia IC Advanced Packaging Market Size by Type (2019-2024)
9.2.2 Asia IC Advanced Packaging Market Size by Type (2025-2030)
9.2.3 Asia IC Advanced Packaging Market Share by Type (2019-2030)
9.3 Asia IC Advanced Packaging Market Size by Application
9.3.1 Asia IC Advanced Packaging Market Size by Application (2019-2024)
9.3.2 Asia IC Advanced Packaging Market Size by Application (2025-2030)
9.3.3 Asia IC Advanced Packaging Market Share by Application (2019-2030)
9.4 Asia IC Advanced Packaging Market Size by Region
9.4.1 Asia IC Advanced Packaging Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia IC Advanced Packaging Market Size by Region (2019-2024)
9.4.3 Asia IC Advanced Packaging Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia

10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America IC Advanced Packaging Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Type
10.2.1 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America IC Advanced Packaging Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Application
10.3.1 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America IC Advanced Packaging Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country
10.4.1 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries

11 Key Players Profiles
11.1 Abel
11.1.1 Abel Company Details
11.1.2 Abel Business Overview
11.1.3 Abel IC Advanced Packaging Introduction
11.1.4 Abel Revenue in IC Advanced Packaging Business (2019-2024)
11.1.5 Abel Recent Developments
11.2 Samsung
11.2.1 Samsung Company Details
11.2.2 Samsung Business Overview
11.2.3 Samsung IC Advanced Packaging Introduction
11.2.4 Samsung Revenue in IC Advanced Packaging Business (2019-2024)
11.2.5 Samsung Recent Developments
11.3 Toshiba
11.3.1 Toshiba Company Details
11.3.2 Toshiba Business Overview
11.3.3 Toshiba IC Advanced Packaging Introduction
11.3.4 Toshiba Revenue in IC Advanced Packaging Business (2019-2024)
11.3.5 Toshiba Recent Developments
11.4 Intel
11.4.1 Intel Company Details
11.4.2 Intel Business Overview
11.4.3 Intel IC Advanced Packaging Introduction
11.4.4 Intel Revenue in IC Advanced Packaging Business (2019-2024)
11.4.5 Intel Recent Developments
11.5 Amkor
11.5.1 Amkor Company Details
11.5.2 Amkor Business Overview
11.5.3 Amkor IC Advanced Packaging Introduction
11.5.4 Amkor Revenue in IC Advanced Packaging Business (2019-2024)
11.5.5 Amkor Recent Developments
11.6 MAK
11.6.1 MAK Company Details
11.6.2 MAK Business Overview
11.6.3 MAK IC Advanced Packaging Introduction
11.6.4 MAK Revenue in IC Advanced Packaging Business (2019-2024)
11.6.5 MAK Recent Developments
11.7 Optocap
11.7.1 Optocap Company Details
11.7.2 Optocap Business Overview
11.7.3 Optocap IC Advanced Packaging Introduction
11.7.4 Optocap Revenue in IC Advanced Packaging Business (2019-2024)
11.7.5 Optocap Recent Developments
11.8 ASE
11.8.1 ASE Company Details
11.8.2 ASE Business Overview
11.8.3 ASE IC Advanced Packaging Introduction
11.8.4 ASE Revenue in IC Advanced Packaging Business (2019-2024)
11.8.5 ASE Recent Developments
11.9 Changing Electronics Technology
11.9.1 Changing Electronics Technology Company Details
11.9.2 Changing Electronics Technology Business Overview
11.9.3 Changing Electronics Technology IC Advanced Packaging Introduction
11.9.4 Changing Electronics Technology Revenue in IC Advanced Packaging Business (2019-2024)
11.9.5 Changing Electronics Technology Recent Developments
11.10 STMicroelectronics
11.10.1 STMicroelectronics Company Details
11.10.2 STMicroelectronics Business Overview
11.10.3 STMicroelectronics IC Advanced Packaging Introduction
11.10.4 STMicroelectronics Revenue in IC Advanced Packaging Business (2019-2024)
11.10.5 STMicroelectronics Recent Developments
11.11 EKSS Microelectronics
11.11.1 EKSS Microelectronics Company Details
11.11.2 EKSS Microelectronics Business Overview
11.11.3 EKSS Microelectronics IC Advanced Packaging Introduction
11.11.4 EKSS Microelectronics Revenue in IC Advanced Packaging Business (2019-2024)
11.11.5 EKSS Microelectronics Recent Developments

12 Analyst's Viewpoints/Conclusions

13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

biaoTi

表と図のリスト

List of Tables
    Table 1. Global IC Advanced Packaging Market Size Growth Rate by Type (US$ Million), 2019 VS 2023 VS 2030
    Table 2. Key Players of 3D
    Table 3. Key Players of 2.5D
    Table 4. Global IC Advanced Packaging Market Size Growth Rate by Application (US$ Million), 2019 VS 2023 VS 2030
    Table 5. Global IC Advanced Packaging Market Size Growth Rate (CAGR) by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 6. Global IC Advanced Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 7. Global IC Advanced Packaging Market Share by Region (2019-2024)
    Table 8. Global IC Advanced Packaging Forecasted Market Size by Region (2025-2030) & (US$ Million)
    Table 9. Global IC Advanced Packaging Market Share by Region (2025-2030)
    Table 10. IC Advanced Packaging Market Trends
    Table 11. IC Advanced Packaging Market Drivers
    Table 12. IC Advanced Packaging Market Challenges
    Table 13. IC Advanced Packaging Market Restraints
    Table 14. Global IC Advanced Packaging Revenue by Players (2019-2024) & (US$ Million)
    Table 15. Global IC Advanced Packaging Revenue Share by Players (2019-2024)
    Table 16. Global Top IC Advanced Packaging by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Advanced Packaging as of 2023)
    Table 17. Global IC Advanced Packaging Industry Ranking 2022 VS 2023 VS 2024
    Table 18. Global 5 Largest Players Market Share by IC Advanced Packaging Revenue (CR5 and HHI) & (2019-2024)
    Table 19. Global Key Players of IC Advanced Packaging, Headquarters and Area Served
    Table 20. Global Key Players of IC Advanced Packaging, Product and Application
    Table 21. Global Key Players of IC Advanced Packaging, Product and Application
    Table 22. Mergers & Acquisitions, Expansion Plans
    Table 23. Global IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 24. Global IC Advanced Packaging Revenue Market Share by Type (2019-2024)
    Table 25. Global IC Advanced Packaging Forecasted Market Size by Type (2025-2030) & (US$ Million)
    Table 26. Global IC Advanced Packaging Revenue Market Share by Type (2025-2030)
    Table 27. Global IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 28. Global IC Advanced Packaging Revenue Share by Application (2019-2024)
    Table 29. Global IC Advanced Packaging Forecasted Market Size by Application (2025-2030) & (US$ Million)
    Table 30. Global IC Advanced Packaging Revenue Share by Application (2025-2030)
    Table 31. North America IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 32. North America IC Advanced Packaging Market Size by Type (2025-2030) & (US$ Million)
    Table 33. North America IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 34. North America IC Advanced Packaging Market Size by Application (2025-2030) & (US$ Million)
    Table 35. North America IC Advanced Packaging Growth Rate (CAGR) by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 36. North America IC Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 37. North America IC Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 38. Europe IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 39. Europe IC Advanced Packaging Market Size by Type (2025-2030) & (US$ Million)
    Table 40. Europe IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 41. Europe IC Advanced Packaging Market Size by Application (2025-2030) & (US$ Million)
    Table 42. Europe IC Advanced Packaging Growth Rate (CAGR) by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 43. Europe IC Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 44. Europe IC Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 45. China IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 46. China IC Advanced Packaging Market Size by Type (2025-2030) & (US$ Million)
    Table 47. China IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 48. China IC Advanced Packaging Market Size by Application (2025-2030) & (US$ Million)
    Table 49. Asia IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 50. Asia IC Advanced Packaging Market Size by Type (2025-2030) & (US$ Million)
    Table 51. Asia IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 52. Asia IC Advanced Packaging Market Size by Application (2025-2030) & (US$ Million)
    Table 53. Asia IC Advanced Packaging Growth Rate (CAGR) by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 54. Asia IC Advanced Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 55. Asia IC Advanced Packaging Market Size by Region (2025-2030) & (US$ Million)
    Table 56. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 57. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Type (2025-2030) & (US$ Million)
    Table 58. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 59. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Application (2025-2030) & (US$ Million)
    Table 60. Middle East, Africa, and Latin America IC Advanced Packaging Growth Rate (CAGR) by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 61. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 62. Middle East, Africa, and Latin America IC Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 63. Abel Company Details
    Table 64. Abel Business Overview
    Table 65. Abel IC Advanced Packaging Product
    Table 66. Abel Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 67. Abel Recent Developments
    Table 68. Samsung Company Details
    Table 69. Samsung Business Overview
    Table 70. Samsung IC Advanced Packaging Product
    Table 71. Samsung Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 72. Samsung Recent Developments
    Table 73. Toshiba Company Details
    Table 74. Toshiba Business Overview
    Table 75. Toshiba IC Advanced Packaging Product
    Table 76. Toshiba Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 77. Toshiba Recent Developments
    Table 78. Intel Company Details
    Table 79. Intel Business Overview
    Table 80. Intel IC Advanced Packaging Product
    Table 81. Intel Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 82. Intel Recent Developments
    Table 83. Amkor Company Details
    Table 84. Amkor Business Overview
    Table 85. Amkor IC Advanced Packaging Product
    Table 86. Amkor Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 87. Amkor Recent Developments
    Table 88. MAK Company Details
    Table 89. MAK Business Overview
    Table 90. MAK IC Advanced Packaging Product
    Table 91. MAK Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 92. MAK Recent Developments
    Table 93. Optocap Company Details
    Table 94. Optocap Business Overview
    Table 95. Optocap IC Advanced Packaging Product
    Table 96. Optocap Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 97. Optocap Recent Developments
    Table 98. ASE Company Details
    Table 99. ASE Business Overview
    Table 100. ASE IC Advanced Packaging Product
    Table 101. ASE Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 102. ASE Recent Developments
    Table 103. Changing Electronics Technology Company Details
    Table 104. Changing Electronics Technology Business Overview
    Table 105. Changing Electronics Technology IC Advanced Packaging Product
    Table 106. Changing Electronics Technology Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 107. Changing Electronics Technology Recent Developments
    Table 108. STMicroelectronics Company Details
    Table 109. STMicroelectronics Business Overview
    Table 110. STMicroelectronics IC Advanced Packaging Product
    Table 111. STMicroelectronics Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 112. STMicroelectronics Recent Developments
    Table 113. EKSS Microelectronics Company Details
    Table 114. EKSS Microelectronics Business Overview
    Table 115. EKSS Microelectronics IC Advanced Packaging Product
    Table 116. EKSS Microelectronics Revenue in IC Advanced Packaging Business (2019-2024) & (US$ Million)
    Table 117. EKSS Microelectronics Recent Developments
    Table 118. Research Programs/Design for This Report
    Table 119. Key Data Information from Secondary Sources
    Table 120. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global IC Advanced Packaging Market Size Growth Rate by Type, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 2. Global IC Advanced Packaging Market Share by Type: 2023 VS 2030
    Figure 3. 3D Features
    Figure 4. 2.5D Features
    Figure 5. Global IC Advanced Packaging Market Size Growth Rate by Application, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 6. Global IC Advanced Packaging Market Share by Application: 2023 VS 2030
    Figure 7. Logic Case Studies
    Figure 8. Imaging and Optoelectronics Case Studies
    Figure 9. Memory Case Studies
    Figure 10. MEMS/Sensors Case Studies
    Figure 11. LED Case Studies
    Figure 12. Power Case Studies
    Figure 13. IC Advanced Packaging Report Years Considered
    Figure 14. Global IC Advanced Packaging Market Size (US$ Million), Year-over-Year: 2019-2030
    Figure 15. Global IC Advanced Packaging Market Size, (US$ Million), 2019 VS 2023 VS 2030
    Figure 16. Global IC Advanced Packaging Market Share by Region: 2023 VS 2030
    Figure 17. Global IC Advanced Packaging Market Share by Players in 2023
    Figure 18. Global Top IC Advanced Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Advanced Packaging as of 2023)
    Figure 19. The Top 10 and 5 Players Market Share by IC Advanced Packaging Revenue in 2023
    Figure 20. North America IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 21. North America IC Advanced Packaging Market Share by Type (2019-2030)
    Figure 22. North America IC Advanced Packaging Market Share by Application (2019-2030)
    Figure 23. North America IC Advanced Packaging Market Share by Country (2019-2030)
    Figure 24. United States IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 25. Canada IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 26. Europe IC Advanced Packaging Market Size YoY (2019-2030) & (US$ Million)
    Figure 27. Europe IC Advanced Packaging Market Share by Type (2019-2030)
    Figure 28. Europe IC Advanced Packaging Market Share by Application (2019-2030)
    Figure 29. Europe IC Advanced Packaging Market Share by Country (2019-2030)
    Figure 30. Germany IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 31. France IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 32. U.K. IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 33. Italy IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 34. Russia IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 35. Nordic Countries IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 36. China IC Advanced Packaging Market Size YoY (2019-2030) & (US$ Million)
    Figure 37. China IC Advanced Packaging Market Share by Type (2019-2030)
    Figure 38. China IC Advanced Packaging Market Share by Application (2019-2030)
    Figure 39. Asia IC Advanced Packaging Market Size YoY (2019-2030) & (US$ Million)
    Figure 40. Asia IC Advanced Packaging Market Share by Type (2019-2030)
    Figure 41. Asia IC Advanced Packaging Market Share by Application (2019-2030)
    Figure 42. Asia IC Advanced Packaging Market Share by Region (2019-2030)
    Figure 43. Japan IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 44. South Korea IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 45. China Taiwan IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 46. Southeast Asia IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 47. India IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 48. Australia IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 49. Middle East, Africa, and Latin America IC Advanced Packaging Market Size YoY (2019-2030) & (US$ Million)
    Figure 50. Middle East, Africa, and Latin America IC Advanced Packaging Market Share by Type (2019-2030)
    Figure 51. Middle East, Africa, and Latin America IC Advanced Packaging Market Share by Application (2019-2030)
    Figure 52. Middle East, Africa, and Latin America IC Advanced Packaging Market Share by Country (2019-2030)
    Figure 53. Brazil IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 54. Mexico IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 55. Turkey IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 56. Saudi Arabia IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 57. Israel IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 58. GCC Countries IC Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 59. Abel Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 60. Samsung Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 61. Toshiba Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 62. Intel Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 63. Amkor Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 64. MAK Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 65. Optocap Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 66. ASE Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 67. Changing Electronics Technology Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 68. STMicroelectronics Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 69. EKSS Microelectronics Revenue Growth Rate in IC Advanced Packaging Business (2019-2024)
    Figure 70. Bottom-up and Top-down Approaches for This Report
    Figure 71. Data Triangulation
    Figure 72. Key Executives Interviewed
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